|
|
| 81. | breaking strain |
| 致断应变 |
|
|
| | |
| 82. | photo ionization |
| 光致电离 |
|
|
| | |
| 83. | wave making resistance |
| 波致阻力 |
|
|
| | |
| 84. | fertility agent |
| 致育因素 |
|
|
| | |
| 85. | fracturing load |
| 致断负载 |
|
|
| | |
| 86. | hydrogen induced cracking |
| 氢致开裂 |
|
|
| | |
| 87. | thermal death point |
| 热致死点 |
|
|
| | |
| 88. | chip level complexity |
| 芯片级致密度 |
|
|
| | |
| 89. | thermogenic action |
| 致热作用 |
|
|
| | |
| 90. | magnetic double refraction |
| 磁场致双折射 |
|
|
| | |