|
|
| 11. | encapsulation testing |
| 封装测试 |
|
|
| | |
| 12. | CSP Chip Size Package |
| 芯片尺寸封装 |
|
|
| | |
| 13. | encapsulated integrated circuit |
| 封装集成电路 |
|
|
| | |
| 14. | packaged magnetron |
| 封装磁控管 |
|
|
| | |
| 15. | packaging density |
| 封装密度 |
|
|
| | |
| 16. | high density packing |
| 高密度封装 |
|
|
| | |
| 17. | data encapsulation |
| 数据封装 |
|
|
| | |
| 18. | package inspection and verificatio |
| 封装检验 |
|
|
| | |
| 19. | crystal packaging |
| 晶体封装 |
|
|
| | |
| 20. | packaging hardware |
| 封装装置 |
|
|
| | |