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21. | wafer throughput rate |
| 薄片处理速度 |
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22. | wafer inspector |
| 晶片检查装置 |
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23. | wafer lithography |
| 晶片光刻 |
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24. | full wafer aligner |
| 整片对准器 |
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25. | wafer nonflatness |
| 薄片的非平面度 |
|
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26. | wafer scale integration |
| 圆片规模集成 |
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27. | compound semiconductor wafer |
| 化合物半导体晶片 |
|
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28. | wafer-contact printing |
| 干胶片接触印刷 |
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29. | wafer dicing saw |
| 切片锯 |
|
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30. | full wafer alignment |
| 整片对准 |
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